OSSIC FRIDAY UPDATE: NOVEMBER 18th, 2016

HARDWARE UPDATES

Hello backers!

We are currently head down testing the latest hardware from our current round of prototyping. With over 10 times the number of conductors, the cable within the headphone has proved to be an interesting challenge for our engineering team, but progress is being made. The cable forms the bridge between the various multiple drivers, microphones, sensors, and the battery. These cables connect the two ear-cups and all the internal electronics to provide playback.

The image below shows co-founder Dave Carr checking on a our headband proto-tool during our latest visit to our headband supplier. The tool utilizes injection molding process to achieve a final headband form. Even in the final phases of our production timeline, we've continued to make small adjustments to mold to improve the clamp force, balancing both comfort and fit.

OSSIC X NAMED AS CES 2017 BEST OF INNOVATION AWARD HONOREE

OSSIC is thrilled to announce that the OSSIC X 3D audio headphone has been honored with the Consumer Electronics Show 2017 Best of Innovation top award in the headphones category only weeks after receiving the Popular Science Grand Award for ‘Best of What’s New in Entertainment’.

The prestigious annual CES Innovation Awards celebrate outstanding product design and engineering in brand-new consumer technology products. These awards are sponsored by the Consumer Technology Association, and are  judged by a distinguished panel of industrial designers, engineers and members of the trade media.  The Best of Innovation Award is awarded to the highest-rated product in each category.

OSSIC AT CES 2017

Will you be at CES 2017 this year ? If you are, we want to meet you ! Team OSSIC will be at CES 2017 at Eureka Park Booth 50400. Let us know if you'll be there by filling out the form below and we'll keep you up to date on special news and updates!

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